Personal Computers Essay

Background. The Personal Computers at their advent were simple machines with less number of parts and limited capabilities. Less power was required to operate the computers and computer heating was never a major problem. However with the development in microprocessor and solid state technologies there was a revolution in how people used computers. The computers today can be configured according to ones needs and many add on components like graphics cards, Modems, USB devices etc. can be fitted on computers . Motherboards today also come with an increased number of components. However with the increase in components a new problem of heating has surfaced in computers. Problems and Motivation Although these components have increased the functionality of computers tremendously it has raised a serious problem of heating. With the increase in number of components the demand for power supply has increased. The components consume more energy and generate large amount heat. Electronic devices perform inefficiently or even get damaged as a result of excessive heat. Hence new challenges to protect these components from getting damaged by proper cooling of heat has emerged. Though the components have increased in numbers the size of PCs has kept reducing. People today prefer smaller PCs for space constraints and aesthetics. In order to keep in line with the reducing sizes the Power supply and the cooling system should also go transformation in sizes. One needs to design cooling systems with greater performances yet at a reduced scale. As the power supply and cooling are the components of PC case there is a need to renovate these cases to protect computer components from getting overheated and damaged. At the same time the it should be scaled down and match the aesthetics of other parts such as monitors, keyboards etc which come in designer shapes today. Research Aims and Objectives With reference to the above discussed problem there is a need to develop PC cases which are responsible for computer cooling. The aim of the project is to create simulation in order to find a better solution over the existing PC Cases and prevent spreading of heat to other components. The project will achieve three main objectives The initial objective would be to understand the principle of fluid dynamics and apply it to the PC Case problem. Secondly we will design a model to convert humid air by applying Computational Fluid Dynamics (CFD) The final objective would be to provide recommendations for the PC Case. Literature Review The preliminary literature was done on the existing problems in PC Cases and the sources of heat in computer system . The current methodologies implemented for cooling were also studied. Basic literature on application of fluid dynamics and use of Computational Fluid Dynamics to solve problems was also reviewed Methodology The Research will be experimental in nature. simulation model of the existing PC Cases will be developed in CFD. The models will be simulated again with modification for the proposed air cooling. The comparison between the two simulation will help in developing the cooling system and designing of the PC Cases. The results obtained will be experimental in nature and the problem is achievable theoretically with the help of CFD. As the project intends to suggest changes over the existing models the use of Simulation is justified to obtain outcomes as the existing systems are already simulated for cooling by making use of CFD. Triangulation: Mathematical models for the fluid dynamics of air can be constructed and solved for various conditions and the outcomes of these can be cross examined with the that of computer simulations. An experimental set-up can be created to check the prototype of cooling system and the results can be compared. Reliability : The prototype and the simulated models can be tested over a number of systems/components from different manufacturers and checked for reliability. Ethics: The project will adhere to all the guidelines and protocols of electronic manufacturing devices in terms of manufacturing, quality and safety. Environment : The proposed PC cases will be environment friendly. It may be manufactured from environmental friendly recycled materials to reducing global warming. Noise reduction will be achieved considerably with the improved change in design. Analysis The outcomes of the project will help in analyzing the reduction achieved in heat generated and the prevention of components. It will also analyze the cost of implementation and its economic feasibility. Conclusion With correct implementation of fluid dynamics modification in the existing PC cases can be achieved to cool heat efficiently and prevent components from overheating. Although the project is experimental in nature and relies mainly on simulation there may be a variation in its actual implementations. Whether the PC Cases behave as recommended can only be judged only by their practical application the project can be a strong foundation to extend this future scope.